Advantages and factors influencing PCB VIA copper filling
Nov. 10, 2021The volume of electronic products is becoming thinner and shorter. Directly stacking holes on through blind holes is a design method to obtain high-de…
The volume of electronic products is becoming thinner and shorter. Directly stacking holes on through blind holes is a design method to obtain high-de…
In the production process of printed circuit board, there are two kinds of electroplating equipment, one is horizontal electroplating line, the other …
Anodizing is the process of forming an oxide film on aluminum products (anodes) under the action of external current. Chemical conductive oxidation (a…
Although the cathode current density of barrel plating is large, due to the great difference in current density, most current is consumed on workpiece…
Flexible PCBs are generally classified as follows according to the number of layers and structure of conductors: 1. Single sided flexible PCB 2. Doubl…